Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device

Jr., A. Sumagpang and Gomez, F. R. and Rodriguez, R. (2020) Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device. Journal of Engineering Research and Reports, 18 (1). pp. 1-7. ISSN 2582-2926

[thumbnail of Sumagpang1812020JERR61339.pdf] Text
Sumagpang1812020JERR61339.pdf - Published Version

Download (241kB)

Abstract

The paper focused in addressing the auto align defect at in-strip testing of a semiconductor scalable device in a leadframe technology. Pareto diagram and potential risk analysis were completed to identify the top reject contributors and eventually come-up with the robust solution. Reverse flow was employed to eliminate the alignment issues. The reverse flow, which is testing prior singulation process, eventually resolved the auto align and other singulation related defects as testing is done on a strip form. Ultimately, the error-proofing or Poka-Yoke approach by reverse flow lead to the elimination of auto align failures at final test. For future works, the parameters and learnings could be used on devices with similar assembly defect occurrence.

Item Type: Article
Subjects: STM Open Press > Engineering
Depositing User: Unnamed user with email support@stmopenpress.com
Date Deposited: 11 Mar 2023 09:14
Last Modified: 06 Sep 2024 08:04
URI: http://journal.submissionpages.com/id/eprint/661

Actions (login required)

View Item
View Item